DARPAs Internetted Unattended Ground Sensors
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The Defense Advanced Research Projects Office has
supported an active program to develop technologies that
advance the state of the art in Unattended Ground
Sensors. SenTech plays an important part in this effort,
first through a SBIR contract and then under the
micro-IUGS Broad Agency Announcement. SenTechs SBIR project is aimed at developing some key technologies that can significantly improve the utility of performance of an UGS using both acoustic and seismic sensors. These technologies include:
Under DARPAs micro-IUGS BAA, SenTech is adapting its acoustic-seismic sensor to fit in the payload of a 40 mm White Star Round. To achieve this goal we had to dramatically reduce the size of the signal processor. SenTech specified and had a subcontractor build a DSP unit consisting of a SHARC DSP chip, two mega-words of SRAM, two mega-bytes of flash memory and eight channels of sigma-delta analog to digital conversion. The overall size of this board is 30 mm by 70 mm. These units have been built and tested. The mechanical problems of delivering a sensor using a 40 mm grenade launcher have been addressed with a shell within a shell approach. A CAD design package has been completed and prototype models have been built using three-dimensional lithography. The small size of this processing unit will also make it a natural for implementing a small hand emplaced unit and an air delivered sensor that can be carried deep into enemy territory by a Remotely Piloted Vehicle. SenTechs track-based approach to target location and identification is particularly well-suited to address the problem of multi-sensor fusion and accurate localization through multilateration. SenTechs programs are supervised by Dr. Ed Carapezza of DARPA and Dr. Dave Law of the US Navy SPAWAR. |
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(781) 279 9871 (781) 279 1873 (Fax) g.prado@sentech-acoustic.com