DARPA’s Internetted Unattended Ground Sensors

The Defense Advanced Research Projects Office has supported an active program to develop technologies that advance the state of the art in Unattended Ground Sensors. SenTech plays an important part in this effort, first through a SBIR contract and then under the micro-IUGS Broad Agency Announcement.

SenTech’s SBIR project is aimed at developing some key technologies that can significantly improve the utility of performance of an UGS using both acoustic and seismic sensors. These technologies include:

  • The use of three-component geophones for improved signal-to-noise data acquisition.
  • Adaptive elimination of the acoustically-coupled components in the seismic signal.
  • Target range estimation by fusion of acoustic and seismic data.
  • Use of a bank of neural networks for target identification and engine type (cylinder) classification.
  • The algorithms were implemented in the C language and compiled to run on an Analog Devices SHARC DSP chip. Three fieldable sensors using off the shelf boards were built. These units have been tested successfully at Ft. Irwin, CA and Ft. Stewart, GA.

Under DARPA’s micro-IUGS BAA, SenTech is adapting its acoustic-seismic sensor to fit in the payload of a 40 mm “White Star” Round. To achieve this goal we had to dramatically reduce the size of the signal processor. SenTech specified and had a subcontractor build a DSP unit consisting of a SHARC DSP chip, two mega-words of SRAM, two mega-bytes of flash memory and eight channels of sigma-delta analog to digital conversion. The overall size of this board is 30 mm by 70 mm. These units have been built and tested.

The mechanical problems of delivering a sensor using a 40 mm grenade launcher have been addressed with a shell within a shell approach. A CAD design package has been completed and prototype models have been built using three-dimensional lithography. The small size of this processing unit will also make it a natural for implementing a small hand emplaced unit and an air delivered sensor that can be carried deep into enemy territory by a Remotely Piloted Vehicle. SenTech’s track-based approach to target location and identification is particularly well-suited to address the problem of multi-sensor fusion and accurate localization through multilateration.

SenTech’s programs are supervised by Dr. Ed Carapezza of DARPA and Dr. Dave Law of the US Navy SPAWAR.  

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